Under the Semiconductor India Program (ISM 1.0), the Government of India has approved 10 semiconductor manufacturing projects in 6 states with a total investment of more than ₹1.60 lakh crore. These projects include leading institutions like Micron, Tata Electronics, CG Power and Keynes Semicon located in Gujarat, Assam, Odisha, Punjab and Andhra Pradesh, which are setting up assembly, testing and fab units.
Two of these units have started commercial production in the last quarter of 2025-26. The foundation stone laying ceremony of one of the sanctioned projects, Heterogeneous Integration Packaging Solutions (3DGS), will be held on Sunday, April 19 in Bhubaneswar, Odisha. It is being told that Odisha Chief Minister Mohan Charan Manjhi, Railways, Information and Broadcasting and Electronics and Information Technology Minister Ashwini Vaishnav and other dignitaries will be present in this ceremony. Preparations regarding this are being finalized.
The foundation stone of India's first advanced 3D glass semiconductor packaging unit will be laid in Bhubaneswar on April 19, 2026. It is being told that this is not just another plant, it is the next generation chip technology that will power AI, defense and high-performance computing. More than ₹ 1,900 crore will be invested in this. This will be the first glass substrate technology of its kind. The government wants to establish Odisha as a global semiconductor hub. The government is continuously working on this.
The development of electronics manufacturing sector has led to a tremendous increase in employment opportunities. According to industry estimates, it will open up approximately 25 lakh jobs, which includes both direct and indirect employment. Out of this total number, the mobile phone manufacturing segment alone will generate around 12 lakh jobs. Which includes manufacturing, logistics, supply chain and other related services. Apart from this, the government is implementing many important schemes to further boost employment by attracting investment.
