Realme is set to up the ante in the upper-midrange smartphone market with its upcoming Neo7 SE, which will be powered by the newly unveiled MediaTek Dimensity 8400 chipset. Following MediaTek’s announcement of the innovative SoC, known for its all-big-core CPU architecture, Realme wasted no time teasing its integration into their latest device.
The Dimensity 8400, MediaTek’s cutting-edge chipset aimed at upper-midrange smartphones, promises significant performance gains. It will debut in the Redmi Turbo 4 launching in early January 2025. However, Realme’s Neo7 SE will soon follow, making it one of the first devices to harness the power of MediaTek’s new technology.
The Neo7 SE will join Realme’s existing Neo7 lineup, which has notably dropped the “GT” branding this year. Positioned just below the Neo7, the Neo7 SE is expected to feature slightly scaled-down specifications while maintaining robust performance, thanks to the Dimensity 8400. This strategic placement ensures a balance between affordability and high-end features for consumers.
While details about the Neo7 SE’s full specifications remain scarce, its integration of the Dimensity 8400 hints at significant upgrades in processing power and energy efficiency. The chipset’s innovative architecture is designed to handle demanding applications, making the Neo7 SE a strong contender in the midrange segment.
